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product structure : silicon monolithic integrated circuit this product has no designed protection against radioactive rays . 1/ 25 tsz02201 - 0r5r0h300140 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 25. aug.2014 rev.001 tsz22111 ? 14 ? 001 www.rohm.com 1 channel compact high side switch ics 1ch adjustable current limit high side switch ics bd 2244 g-m BD2245G-M general description bd224 4g -m and bd224 5g -m are low on-resistance n-channel mosfet high-side power switches, optimized for universal serial bus (usb) applications. bd224 4g -m and bd224 5g -m are equipped with the function of over-current detection, thermal shutdown, under -voltage lockout and soft-start. moreover, the range of current limit threshold can be adjusted from 0.2a to 1.7a by changing the external resistance features ? aec -q100 qualified ? adjustable current limit threshold: 200ma to 1. 7a ? built-in low on-resistance (typ 100m ) n-channel mosfet built- in ? soft-start circuit ? output discharge function ? open-drain fault flag output ? thermal shutdown ? u nder -voltage lockout ? reverse current protection when power switch o ff ? control input logic ? active-high: bd2244g-m ? active-low: BD2245G-M applications car accessory key specifications ? input voltage range: 2.8v to 5.5v ? on resistance: (in=5v) 100m (typ) ? current limit threshold: 0.2a to 1.7a adjustable ? standby current: 0.01 a ( typ) ? operating temperature range: -40 c to +85c package w(typ) x d(typ) x h(max) typical application circuit lineup outpu t load current adjustable current limit threshold channel control input logic package orderable part number max 1 . 5a 200 ma to 1.7a 1ch high ssop6 reel of 3000 bd2244g C mg tr 1.5a 200 ma to 1.7a 1ch low ssop6 reel of 3000 bd2245g C mg tr s sop6 2.90mm x 2.80mm x 1.25mm fig ure 1 . typical application circuit c l 120 datashee t
2/ 25 tsz02201 - 0r5r0h300140 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 25. aug.2014 rev.001 www.rohm.com t sz22111 ? 15 ? 001 b d2244g - m bd 2245g - m block diagram pin configuration pin descriptions pin no. symbol i/o function 1 in i switch input and the supply voltage for the ic. 2 gnd - ground . 3 en i enable input. high - level input tu rns on the switch (bd2244g - m) low - level input turns on the switch (bd2245g - m) 4 /oc o over - current detection terminal. low level output during over - current or over - temperature condition. open - drain fault flag output. 5 ilim o c urrent limit threshold s et pin. external resistor used to set c urrent limit threshold. recommended 1 1.97 k r lim 106.3 k 6 out o power s witch output. figure 2 . block diagram fig ure 3 . pin configuration (top view) over - current protection under - voltage lockout delay counter charge pump thermal shutdown en in /oc gnd out /en reverse current protection ilim out gnd en ilim /oc in 1 2 3 4 5 6
3/ 25 tsz02201 - 0r5r0h300140 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 25. aug.2014 rev.001 www.rohm.com t sz22111 ? 15 ? 001 b d2244g - m bd 2245g - m absolute maximum ratings (ta= 25 c ) parameter symbol rating unit in supply voltage v in - 0.3 to +7.0 v en input voltage v en - 0.3 to +7.0 v ilim voltage v ilim - 0.3 to +7.0 v ilim source cur rent i ilim 1 ma /oc voltage v /oc - 0.3 to +7.0 v /oc sink current i /oc 10 ma out voltage v out - 0.3 to +7.0 v storage temperature tstg - 55 to +150 c power dissipation pd 0.67 (note1 ) w (note 1) mounted on 70mm x 70mm x 1.6mm glass epoxy board. reduce 5.4mw per 1 above 25 caution: operating the ic over the absolute maximum ratings may damage the ic. in addition, it is impossible to predict all destructive situations such as short - circuit modes, open circuit modes, etc. therefore, it is important to consider circ uit protection measures, like adding a fuse, in case the ic is operated in a special mode exceeding the absolute maximum ratings. recommended operating conditions parameter symbol rating unit min typ max in operating voltage v in 2.8 5.0 5.5 v operat ing temperature t opr - 40 - +85 c electrical characteristics (v in = 5v, r lim =20k , ta = 25c, unless otherwise specified.) dc characteristics parameter symbol limit unit conditions min typ max operating c urrent i dd - 120 168 a v en = 5v, v out = open, (bd2244g - m) v en = 0v, v out = open, (bd2245g - m) standby c urrent i stb - 0.01 5 a v en = 0v, v out = open , (bd2244g - m) v en = 5v, v out = open , (bd2245g - m) en input voltage v enh 2.0 - - v high input v enl - - 0.8 v low input en input leakage i en - 1 0.01 1 a v en = 0v or 5v on - resistance r on - 100 130 m i out = 500ma reverse leak current i rev - - 1 a v out = 5v, v in = 0v current limit threshold i th 112 212 313 ma r lim = 100 k 911 1028 1145 r lim = 20k 1566 1696 1826 r lim = 12 k output discharge resistance r disc 30 60 120 i out = - 1ma, v en = 0v (bd2244g - m) i o ut = - 1ma, v en = 5v (bd2245g - m) /oc output low voltage v /oc - - 0.4 v i /oc = - 1ma uvlo threshold v tuv h 2.35 2.55 2.75 v v in increasing v tuv l 2.30 2.50 2.7 0 v v in decreasing ac characteristics parameter symbol limits unit conditions min typ max output r ise time t on1 - 0.6 6 m s r l = 10 0 output turn - on time t on 2 - 1 10 m s output fall time t off1 - 1.8 20 s output turn - off time t off2 - 3.2 40 s /oc delay time t /oc 4 7 12 ms
4/ 25 tsz02201 - 0r5r0h300140 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 25. aug.2014 rev.001 www.rohm.com t sz22111 ? 15 ? 001 b d2244g - m bd 2245g - m measurement circuit a. operating current, stan dby c urrent b. en i nput v oltage, o utput r ise/ f all t ime output turn - on/ turn - off time c. on - r esistance, current limit threshold, /oc delay time use capacitance more than 100 f at output short circuit test by using external power supply. d. /oc output low voltage e. uvlo threshold f. output discharge resistance figure 4 . measurement circuit timing diagram figure 5. o utput r ise/ f all t ime (bd2244g - m) figure 6. output rise/fall time ( bd2245g - m ) in gnd en out /oc v in v en a 1 f ilim r lim c in = i in in gnd en out /oc v in v en 1 f r l ilim r lim c in = in en out /oc v in v en 1 f a i in 10k ilim r lim gnd 100 f i out c l = c in = 100 f in en out /oc v in v en 1 f 1ma ilim r lim gnd 100 f i out c l = c in = i /oc = in gnd en out /oc v in v en 1 f r l ilim r lim c in = in gnd en out /oc v in v en 1 f ilim r lim c in = 1ma i out = t on1 t off1 90% 10% 10% t on2 t off2 v enh v enl 90% v en v out t on1 t off1 90% 10% 10% t on2 t off2 v enl v enh 90% v en v out
5/ 25 tsz02201 - 0r5r0h300140 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 25. aug.2014 rev.001 www.rohm.com t sz22111 ? 15 ? 001 b d2244g - m bd 2245g - m typical performance curves ta=25 c r lim =20k figure 7 . operating c urrent vs supply voltage ( en enable ) v in =5.0v r lim =20k figure 8 . operating c urrent vs ambient temperature ( en enable ) ta=25 c r lim =20k figure 9 . standby c urrent vs supply voltage ( en d isable ) v in =5.0v r lim =20k figure 10 . standby c urrent vs ambient temperature ( en disable ) 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 ambient temperature : ta[c] standby current : i stb [a] 0.0 0.2 0.4 0.6 0.8 1.0 2 3 4 5 6 supply voltage : v in [v] standby current : i stb [a] 0 40 80 120 160 -50 0 50 100 ambient temperature : ta[c] operationg current : i dd [a] 0 40 80 120 160 2 3 4 5 6 supply voltage : v in [v] operating current : i dd [a]
6/ 25 tsz02201 - 0r5r0h300140 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 25. aug.2014 rev.001 www.rohm.com t sz22111 ? 15 ? 001 b d2244g - m bd 2245g - m typical performance curves - continued ta=25 c r lim =20k low to high high to low figure 11 . en i nput v oltage vs supply voltage v in =5.0v r lim =20k low to high high to low figure 12 . en i nput v oltage vs ambient temperature ta=25 c r lim =20k i out =500ma figure 13 . on - r esistance vs supply voltage v in =5.0v r lim =20k i out =500ma figure 1 4 . on - r esistance vs ambient temperature 0 50 100 150 200 -50 0 50 100 ambient temperature : ta[c] on resistance : r on [m ] 0 50 100 150 200 2 3 4 5 6 supply voltage : v in [v] on resistance : r on [m ] 0.0 0.5 1.0 1.5 2.0 -50 0 50 100 ambient temperature : ta[c] enable input voltage : v en [v] 0.0 0.5 1.0 1.5 2.0 2 3 4 5 6 supply voltage : v in [v] enable input voltage : v en [v]
7/ 25 tsz02201 - 0r5r0h300140 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 25. aug.2014 rev.001 www.rohm.com t sz22111 ? 15 ? 001 b d2244g - m bd 2245g - m typical performance curves - continued v in =5.0v r lim =100k figure 1 6 . over - c urrent t hreshold 1 vs ambient temperature ta=25 c r lim =20k figure 1 7 . over - c urrent t hreshold 2 vs supply voltage v in =5.0v r lim =20k figure 1 8 . over - c urrent t hreshold 2 vs ambient temperature ta=25 c r lim =100k figure 1 5 . over - c urrent t hreshold 1 vs supp ly voltage 0.0 0.1 0.2 0.3 0.4 0.5 -50 0 50 100 ambient temperature : ta[c] over current threshold : i th [a] 0.8 0.9 1.0 1.1 1.2 1.3 2 3 4 5 6 supply voltage : v in [v] over current threshold : i th [a] 0.8 0.9 1.0 1.1 1.2 1.3 -50 0 50 100 ambient temperature : ta[c] over current threshold : i th [a] 0.0 0.1 0.2 0.3 0.4 0.5 2 3 4 5 6 supply voltage : v in [v] over current threshold : i th [a]
8/ 25 tsz02201 - 0r5r0h300140 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 25. aug.2014 rev.001 www.rohm.com t sz22111 ? 15 ? 001 b d2244g - m bd 2245g - m typical performance curves - continued v in =5.0v r lim =12k figure 20 . over - c urrent t hreshold 3 vs ambient temperature ta=25 c r lim =20k i /oc = 1ma figure 2 1 . /oc o utput l ow v oltage vs supply voltage v in =5.0v r lim =20k i /oc =1ma figure 2 2 . /oc o utput l ow v oltage vs ambient temperature ta=25 c r lim =12k figure 1 9 . over - c urrent t hreshold 3 vs supply voltage 0 20 40 60 80 100 -50 0 50 100 ambient temperature : ta[c] /oc output low voltage : v /oc [mv] 0 20 40 60 80 100 2 3 4 5 6 supply voltage : v in [v] /oc output low voltage : v /oc [mv] 1.5 1.6 1.7 1.8 1.9 2.0 -50 0 50 100 ambient temperature : ta[c] over current threshold : i th [a] 1.5 1.6 1.7 1.8 1.9 2.0 2 3 4 5 6 supply voltage : v in [v] over current threshold : i th [a]
9/ 25 tsz02201 - 0r5r0h300140 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 25. aug.2014 rev.001 www.rohm.com t sz22111 ? 15 ? 001 b d2244g - m bd 2245g - m typical performance curves - continued v in =5.0v r lim =20k r l =100 figure 26 . output r ise t ime vs ambient temperature r lim =20k v tuvh v tuvl figure 2 3 . uvlo t hreshold vs ambient temperature r lim =20k figure 2 4 . uvlo hysteresis voltage vs ambient temperature ta=25 c r lim =20k r l =100 figure 2 5 . output r ise t ime vs supply voltage 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50 0 50 100 ambient temperature : ta[c] output rise time : t on1 [ms] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 2 3 4 5 6 supply voltage : v in [v] output rise time : t on1 [ms] 0.0 0.2 0.4 0.6 0.8 1.0 -50 0 50 100 ambient temperature : ta[c] uvlo hysteresis voltage:v hsy [v] 2.2 2.3 2.4 2.5 2.6 2.7 -50 0 50 100 ambient temperature : ta[ ] uvlo threshold : v tuvh , v tuvl [v]
10/ 25 tsz02201 - 0r5r0h300140 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 25. aug.2014 rev.001 www.rohm.com t sz22111 ? 15 ? 001 b d2244g - m bd 2245g - m typical performance curves - continued ta=25 c r lim =20k r l =100 figure 2 7 . output t urn - o n t ime vs supply voltage v in =5.0v r lim =20k r l =100 figure 2 8 . output t urn - o n t ime vs ambient temperature ta=25 c r lim =20k r l =100 figure 2 9 . output f al l t ime vs supply voltage v in =5.0v r lim =20k r l =100 figure 30 . output f all t ime vs ambient temperature 0.0 1.0 2.0 3.0 4.0 5.0 -50 0 50 100 ambient temperature : ta[c] output fall time : t off1 [s] 0.0 1.0 2.0 3.0 4.0 5.0 2 3 4 5 6 supply voltage : v in [v] output fall time : t off1 [s] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -50 0 50 100 ambient temperature : ta[c] output turn on time : t on2 [ms] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 2 3 4 5 6 supply voltage : v in [v] output turn on time : t on2 [ms]
11 / 25 tsz02201 - 0r5r0h300140 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 25. aug.2014 rev.001 www.rohm.com t sz22111 ? 15 ? 001 b d2244g - m bd 2245g - m typical performance curves - continued t a=25 c r lim =20k r l =100 figure 3 1 . output t urn - o ff t ime vs supply voltage v in =5.0v r lim =20k r l =100 figure 3 2 . output t urn - o ff t ime vs ambient temperature ta=25 c r lim =20k figure 3 3 . /oc d elay t ime vs supply voltage v in =5.0v r lim =20k figure 3 4 . /oc d ela y t ime vs ambient temperature 0 2 4 6 8 10 -50 0 50 100 ambient temperature : ta[c] /oc delay time : t /oc [ms] 0 2 4 6 8 10 2 3 4 5 6 supply voltage : v in [v] /oc delay time : t /oc [ms] 0.0 1.0 2.0 3.0 4.0 5.0 6.0 -50 0 50 100 ambient temperature : ta[c] output turn off time : t off2 [s] 0.0 1.0 2.0 3.0 4.0 5.0 6.0 2 3 4 5 6 supply voltage : v in [v] output turn off time : t off2 [s]
12/ 25 tsz02201 - 0r5r0h300140 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 25. aug.2014 rev.001 www.rohm.com t sz22111 ? 15 ? 001 b d2244g - m bd 2245g - m typical performance curves - continued ta=25 c r lim =20k i out =1ma figure 35 . discharge o n r esistance vs supply voltage v in =5.0v r lim =20k i out =1ma figure 36 . discharge o n r esistance vs ambient temperature 0 50 100 150 200 -50 0 50 100 ambient temperature : ta[c] disc on resistance : r disc [] 0 50 100 150 200 2 3 4 5 6 supply voltage : v in [v] dsic on resistance : r disc [ ]
13/ 25 tsz02201 - 0r5r0h300140 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 25. aug.2014 rev.001 www.rohm.com t sz22111 ? 15 ? 001 b d2244g - m bd 2245g - m typical wave forms time ( 20ms/di v.) figure 40 . over c urrent response ramped load time ( 1ms/div.) figure 3 9 . inrush c urrent response (bd2244g - m) time ( 0.5ms/div.) figure 3 7 . output r ise c haracteristic (bd2244g - m) time ( 1 s/div.) figure 3 8 . output f all c haracteristic (bd2244g - m) c l =47 f c l =100 f v /oc (5v/div.) v out (5v/div.) i in (50ma/div.) v in =5v r lim =20k r l =100 v in =5v r lim =20k r l =100 v en (5v/div.) v /oc (5v/div.) v out (5v/div.) i in (50ma/div.) v en (5v/div.) v in =5v r lim =20k r l =100 c l =220 f c l =47 f c l =100 f v /oc (5v/div.) v out (5v/div.) i in (0.5a/div.) v en (5v/div.) v /oc (5v/div.) v out (5v/div.) i in (0.5a/div.) v in =5v r lim =20k c l =100 f current limit threshold l imit current
14/ 25 tsz02201 - 0r5r0h300140 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 25. aug.2014 rev.001 www.rohm.com t sz22111 ? 15 ? 001 b d2244g - m bd 2245g - m typical wave forms - continued time ( 20ms/div.) figure 4 1 . over c urrent response e nable in to s hort circuit (bd2244g - m) time ( 20ms/div.) figure 4 2 . over c urrent response dise nable from s hort c ircuit (bd2244g - m) v /oc (5v/div.) v out (5v/d iv.) i in (0.5a/div.) v en (5v/div.) v /oc (5v/div.) v out (5v/div.) i in (0.5a/div.) v en (5v/div.) v in =5v r lim =20k c l =100 f v in =5v r lim =20k c l =100 f tsd detection tsd recovery tsd detection tsd recovery removal of load time ( 1s/div.) figure 44 . uvlo response decreasing v in (bd2244g - m) v /oc (5v/div.) v out (5v/div.) i in (50ma/div.) v in (5v/div.) v /oc =3.3v r lim =20k r l =100 v in =v en uvlo detection time ( 1s/div.) figure 4 3 . uvlo response increasing v in (bd2244g - m) v /oc (5v/div.) v out (5v/div.) i in (5 0ma/div.) v in (5v/div.) v /oc =3.3v r lim =20k r l =100 v in =v en uvlo recovery
15/ 25 tsz02201 - 0r5r0h300140 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 25. aug.2014 rev.001 www.rohm.com t sz22111 ? 15 ? 001 b d2244g - m bd 2245g - m typical wave forms - continued time ( 2ms/div.) figure 4 5 . over c urrent response 1 load connected at enable v out (5v/div.) i in (1a/div.) v /oc (5v/div.) v in =5v r lim =20k c l =100 f v out (5v/div.) i in (1a/div.) v /oc (5v/div.) v out (5v/div.) i in (1a/div.) v /oc (5v/div.) v out (5v/div.) i in (1a/div.) v /oc (5v/div.) time ( 5 s/div. ) figure 4 6 . over c urrent response 1 load connected at enable time ( 5 s/div.) figure 4 8 . over c urrent response 0 load connected at enable time ( 2ms/div.) figure 4 7 . over c urrent response 0 load connected at enable v in =5v r lim =20k c l =100 f v in =5v r lim =20k c l =100 f v in =5v r lim =20k c l =100 f
16/ 25 tsz02201 - 0r5r0h300140 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 25. aug.2014 rev.001 www.rohm.com t sz22111 ? 15 ? 001 b d2244g - m bd 2245g - m application circuit example figure 49 . application circuit example application information when excessive current flows due to output short-circuit or so, ringing occurs by inductance of power source line and ic. this may cause bad effects on ic operations. in order to avoid this case, a bypass capacitor (c in ) should be connecte d across the in terminal and gnd terminal of ic. a 1f or higher value is recommended. moreover, in order to decrease voltage fluctuations of power source line and ic, connect a low esr capacitor in parallel with c in. a 10 f to 100 f or higher is effective. pull up /oc output by resistance 10k to 100k. set up values for c l which satisfies the application. this application circuit does not guarantee its operati on . when using the circuit with changes to the external circuit constants, make sure to leave an adequate margin for external components including ac/dc characteristics as well as the dispersion of the ic. functional description 1. switch operation in terminal and out terminal are connected to the drain and the source of switch mosfet respectively. the in terminal is also used as power source input to internal control circuit. when the switch is turned on from en control input, the in and out terminals are connected by a 100m (typ) switch. in on status, the switch is bidirectional. therefore, when the potential of out terminal is higher than that of the in terminal, current flows from out terminal to in terminal. since a parasitic diode between the drain and the source of switch mosfet is canceled, current flow from out to in is prevented during off state. 2. thermal shutdown circuit ( tsd) if over - current would continue, the temperature of the ic would increase drastically. if the junction temperature goes beyond 120 (typ) in the condition of over - current detection, thermal shutdown circuit operates and turns power switch off , causing the ic to output a fault flag (/oc). then, when the junction temperature decreases lower than 110 (typ), the power switch is turned on and fault flag (/oc) is cancelled. also, regardless of over - current condition, if the junction temperature were beyond 160 (typ), thermal shutdown circuit makes power switch turn off and outputs fault flag (/oc). when junction temperature decreases lower t han 140 (typ), power switch is turned on and fault flag (/oc) is cancelled. t his operation repeats , u nless the increase of chips temperature is removed or the output of power switch is turned off. fault flag (/oc) is output without delay time at thermal s hutdown. the thermal shutdown circuit operates when the switch is on ( en signal is active). 3. over-current detection (ocd) the over-current detection circuit limits current (i sc ) and outputs error flag (/oc) when current flowing in each switch mosfet exceeds a specified value. the over-current detection circuit works when the switch is on ( en signal is active). there are three types of response against over-current . (1) when the switch is turned on while the output is in short circuit status, the switch gets into current limit status immediately. (see figure 41) (2) when the output short-circuits or high capacity load is connected while the switch is on, very large current flows until the over-current limit circuit reacts. when the current detection and limit circuit operates, current limitation is carried out. (see figure 45) controller 10k to 100k c l c in in gnd en out /oc 5v (typ) + - r lim ilim
17/ 25 tsz02201 - 0r5r0h300140 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 25. aug.2014 rev.001 www.rohm.com t sz22111 ? 15 ? 001 b d2244g - m bd 2245g - m (3) when the output current increases gradually, current limitation would not operate unless the output current exceeds the over-current detection value. when it exceeds the detection value, current limitation is carried out. (see figure 40 ) 4. under-voltage lockout (uvlo) uvlo circuit prevents the switch from turning on until the v in exceeds 2.55v(typ). if the v in drops below 2.5v(typ) while the switch turns on, then uvlo shuts off the power switch. uvlo has hysteresis of 50mv(typ). under-voltage lockout circuit operates when the switch is on ( en signal is active). (see figure 43, 44) 5. fault flag (/oc) output fault flag output is an n-mos open drain output. at detection of over-current or thermal shutdown, output is low-level. over-current detection has delay filter. this delay filter prevents instantaneous current detection such as in r ush current at switch on, hot plug from being informed to outside, but if charge up time for output capacitance is longer than delay time, fault flag output asserts low level. when output current is close to current limit threshold value, fault flag output (/oc) might be low level before turning to over-current condition because it is affected by current swinging or noise. if fault flag output is unused, /oc pin should be connected to open or ground line. figure 50 . over-current detection figure 51 . over-current detection, thermal shutdown timing (bd2244g- m) v out i out v /oc t /oc over - current detection limit current over - current load removed i th v en v out i out v /oc over - current detection thermal shutdown /oc delay time thermal shutdown recover
18/ 25 tsz02201 - 0r5r0h300140 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 25. aug.2014 rev.001 www.rohm.com t sz22111 ? 15 ? 001 b d2244g - m bd 2245g - m figure 52. over-current detection, thermal shutdown timing (bd2245g- m) 6. adjustable current limit threshold bd2244/45g-m is able to change over-current detection value from 200ma to 1.7a by connecting resistance (r lim ) between ilim pin and gnd pin. the resistance value from 11.97k to 106.3k is recommended for r lim. the relational expression and the table for resistance value and over-current detection value are described below. allocate r lim close to ic as possible. be careful not to be affected by parasitic resistance of board pattern because over-current detection value is depended on the resistance value between ilim pin and gnd pin. ilim pin cannot be used as open and short to gnd pin. the r lim resistance tolerance directly affects the current limit threshold accuracy. recommended to use low tolerance resistance. over current threshold equation, ith(typ)[ma] = 19364 r lim [k ] - 0.98 ith(min)[ma] = ith(typ)[ma] 0.98 - 96 ith(max)[ma] = ith(typ)[ma] 1.02 + 96 figure 5 3. ith vs. r lim graph v en v out i out v /oc over - current detection thermal s hutdown /oc delay time thermal s hutdown recover 0 200 400 600 800 1000 1200 1400 1600 1800 2000 0 20 40 60 80 100 120 current limit resistor : r lim [k ] current limit threshold : ith [ma] typ. min. max.
19/ 25 tsz02201 - 0r5r0h300140 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 25. aug.2014 rev.001 www.rohm.com t sz22111 ? 15 ? 001 b d2244g - m bd 2245g - m r lim (k ) current limit threshold (ma) min typ max 106.30 100 200 300 70.28 198 300 402 52.40 296 400 504 41.73 394 500 606 34.65 492 600 708 29.60 590 700 810 25.83 688 800 912 22.91 786 900 1014 20.57 884 1000 1116 18.67 982 1100 1218 17.08 1080 1200 1320 15.74 1178 1300 1422 14.59 1276 1400 1524 13.60 1374 1500 1626 12.73 1472 1600 1728 11.97 1570 1700 1830 table 1. ith tolerance vs. r lim 7. output discharge function when the switch is turned o ff from d isable control input or uvlo function, the 6 0 (typ ) discharge circuit between out and gnd turns on. by turning on this switch, electric charge at capacitive load is discharged. but when the voltage of in declines extremely, then the out pin becomes hi -z without uvlo function .
20/ 25 tsz02201 - 0r5r0h300140 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 25. aug.2014 rev.001 www.rohm.com t sz22111 ? 15 ? 001 b d2244g - m bd 2245g - m power dissipation (ssop6 package) figure 54 . power dissipation curve (pd -ta curve) i/o equivalence circuit symbol pin no. e quivalent circuit en 3 /oc 4 ilim 5 out 6 * 70mm x 70mm x 1.6mm glass epoxy board 85 en /oc ilim out 0 100 200 300 400 500 600 700 0 25 50 75 100 125 150 ambient temperature : ta [ ] power dissipation : pd [mw]
21/ 25 tsz02201 - 0r5r0h300140 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 25. aug.2014 rev.001 www.rohm.com t sz22111 ? 15 ? 001 b d2244g - m bd 2245g - m operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance supply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. furthermore, connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal and large-current ground traces, the two ground traces should be routed separately but c onnected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground lines must be as short and thick as possible to reduce line impedance. 5. thermal consideration should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. the absolute maximum rating of the pd stated in this specification is when the ic is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. in case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expected characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the conditions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one power supply. therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field may cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharge capacitors completely after each process or step. the ics power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mounting the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos transistor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the electric field from the outside can easily charge it. the small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise specified, unused input pins should be connected to the power supply or ground line.
22/ 25 tsz02201 - 0r5r0h300140 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 25. aug.2014 rev.001 www.rohm.com t sz22111 ? 15 ? 001 b d2244g - m bd 2245g - m operational notes C continued 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate layers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a parasitic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the gnd voltage to an input pin (and thus to the p substrate) should be avoided. figure 55. example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias and others. 14. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prevents heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit that will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal operation. note that the tsd circuit operates in a situation that exceeds the absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set design or for any purpose other than protecting the ic from heat damage. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c b e transistor (npn) resistor n region close-by parasitic elements
23/ 25 tsz02201 - 0r5r0h300140 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 25. aug.2014 rev.001 www.rohm.com t sz22111 ? 15 ? 001 b d2244g - m bd 2245g - m ordering information b d 2 2 4 4 g - m g t r part number package g: ssop6 product rank m: for automotive packaging and forming specification g: halogen free tr : embossed tape and reel b d 2 2 4 5 g - m g t r part number package g: ssop6 product rank m: for automotive packaging and forming specification g: halogen free tr : embos sed tape and reel marking diagram part number part number marking bd2244g - m bl bd2245g - m b m part number marking ssop6 (top view) lot number 1 2 1pin mark
24/ 25 tsz02201 - 0r5r0h300140 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 25. aug.2014 rev.001 www.rohm.com t sz22111 ? 15 ? 001 b d2244g - m bd 2245g - m physical dimension, tape and reel information package name ssop6
25/ 25 tsz02201 - 0r5r0h300140 - 1 - 2 ? 20 14 rohm co., ltd. all rights reserved. 25. aug.2014 rev.001 www.rohm.com t sz22111 ? 15 ? 001 b d2244g - m bd 2245g - m revision history date revision changes 25 . aug .201 4 001 new release
datasheet datasheet notice ? ss rev.002 ? 2013 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. if you intend to use our products in devices requiring extremely high reliability (such as medical equipment (note 1) , aircraft/spacecraft, nuclear power controllers, etc.) and whos e malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sales representative in advance. unless otherwise agreed in writ ing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses in curred by you or third parties arising from the use of any rohm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class classb class class class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are not designed under any special or extr aordinary environments or conditi ons, as exemplified below. accordingly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any rohm?s products under an y special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used; if flow soldering met hod is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification
datasheet datasheet notice ? ss rev.002 ? 2013 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.
datasheet datasheet notice ? we rev.001 ? 2014 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information.

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